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CLEANING
PROTOCOLS |
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Definition
of the contamination affecting the exposed equipment will dictate the chemistry
and the procedures used in restoring contaminated equipment. |
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Electronic
assemblies contain an extremely wide range of materials in their configurations.
Many electronic parts and sub-assemblies contain plastic components that
are manufactured using "Ultrasonic Welding" techniques. This approach
joins two separate plastic parts by ultrasonically vibrating said parts
until the material at their joining point liquefies and bonds together.
As a result, Ultrasonic-cleaning protocols could very possibly damage these
assemblies, causing these initial ultrasonic bonds to open. |
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STS
does not employ Ultrasonic Cleaning protocols when addressing ANY electronic
cleaning effort in order to not inflict any additional trauma to the equipment
being cleaned. |
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return
to Protective Measures list |