CLEANING PROTOCOLS

 

Definition of the contamination affecting the exposed equipment will dictate the chemistry and the procedures used in restoring contaminated equipment.

 

Electronic assemblies contain an extremely wide range of materials in their configurations. Many electronic parts and sub-assemblies contain plastic components that are manufactured using "Ultrasonic Welding" techniques. This approach joins two separate plastic parts by ultrasonically vibrating said parts until the material at their joining point liquefies and bonds together. As a result, Ultrasonic-cleaning protocols could very possibly damage these assemblies, causing these initial ultrasonic bonds to open.

 

STS does not employ Ultrasonic Cleaning protocols when addressing ANY electronic cleaning effort in order to not inflict any additional trauma to the equipment being cleaned.

 

 

 

 

 

 

 

 

 

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